AIPUPOWER is pleased to announce our participation in ELEXCON Shenzhen 2026 (Shenzhen International Electronics Exhibition & Embedded Systems Expo), taking place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao'an).

At the Center of South China’s Electronics & Embedded Ecosystem

Co-located with CIOE and IICIE, ELEXCON Shenzhen serves as a vital platform connecting component innovators, embedded developers, and system architects. Spanning 320,000 square meters and bringing together more than 240,000 professional attendees, the exhibition highlights rapid advancements across embedded AI, edge computing, semiconductor integration, and advanced packaging.

As modern hardware architectures demand higher compute density and tighter board space, robust and thermally balanced modular power conversion remains essential to overall system stability.

Versatile Power Solutions for Diverse Engineering Demands

At Booth 16D36, AIPUPOWER will showcase a flexible selection of compact, industrial-grade        AC-DC converters and        DC-DC modular power supplies designed to meet demanding electrical and thermal constraints across modern hardware designs:

• High Power Density & Compact Footprints: Engineered to fit space-constrained board layouts while maintaining high conversion efficiency and low thermal stress.
• Wide Input Ranges & High Isolation: Built with robust isolation barriers and wide input tolerances to ensure stable power delivery amid fluctuating voltage conditions.
• Enhanced EMC & Low Ripple Performance: Optimized internal filtering stages to suppress electrical noise and simplify design-in compliance for sensitive circuitry.
• Flexible Customization & Standard Pinouts: Offering proven industry-standard topologies alongside flexible parameter adaptations to support diverse hardware architectures.

Connect With Our Team on Site

Throughout the three-day event, AIPUPOWER’s engineering and sales specialists will be available to support your hardware roadmap:

• Discuss custom topology adjustments, specialized mechanical packages, and thermal management strategies.
• Fast-track pin-for-pin replacement evaluations to de-risk supply chain dependencies and optimize BOM costs.
• Explore commercial distribution partnerships and technical collaboration for regional and global markets.

Exhibition Details

• Exhibition: ELEXCON Shenzhen 2026
• Dates: September 9 – 11, 2026
• Venue: Shenzhen World Exhibition & Convention Center (Bao'an, Shenzhen, China)
• Booth Location: Hall 16, Booth 16D36

Meet Us in Shenzhen

We welcome system designers, hardware developers, and procurement managers to visit our booth for practical technical discussions and live product evaluations.

Planning your visit? Please feel free to contact us directly to arrange an on-site consultation or request product datasheets in advance.